nanoSkunkWorkX funding
Develops graphene-copper thin-film interfaces that improve heat and current handling in AI chip packaging. Headquarters: Malaysia.
Funding rounds
- nanoSkunkWorkX raises $2M Seed, . AI infrastructure. Led by Tin Men Capital. Develops graphene-copper thin-film interfaces that improve heat and current handling in AI chip packaging.
Questions
How much has nanoSkunkWorkX raised?
nanoSkunkWorkX has raised $2M in the 1 round Roundup tracks, most recently a Seed announced Sep 2, 2026.
What is nanoSkunkWorkX's valuation?
No valuation has been reported for nanoSkunkWorkX's tracked rounds.
Who invests in nanoSkunkWorkX?
Tin Men Capital.